IGBT Power Module Assembly System
With Famous Precise SMT Equipment
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SV Series
  • SV-350
    IGBT power die bond, 4 bonding heads, 1500 uph, High-precision, Multiple feeding system...
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  • SV-300
    IGBT power die bond, 4 bonding heads, 3000 cph, high-precision, Flexibly meet the requirements of IGBT multiple chips bonding simultaneous.
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