BCB was invited to participate in IC Packaging Fair of NEPCON SOUTH is Shenzhen Int’l Exhibition & Convention Center. We had brought our newly model SV-360L Power-Die assembly machine was showcased as a highlight in the IGBT & SiC module packaging and testing process demonstration line.

The SV360L structure is integrated the platform and nozzle heating temperature controllable special for die assembly of pre-sintering (silver paste / silver preform) process. Machine adapted multiple feeding module selectable (Waffle Tray, Wafer, Tape) to meet the various production processes requirement and the placement accuracy as ±10um.